Global Semiconductor Backend Equipment Market Research Report 2018

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The Semiconductor Backend Equipment market research report from Marketresearchpro consolidates the most important industry information while highlighting essential and valuable data regarding the status quo and trajectory of the Semiconductor Backend Equipment industry with forecasts through next 5 years.

A management summary, key facts & figures, SWOT analysis and chief executive quotes on the latest developments in Semiconductor Backend Equipment industry provide a substantial introduction. The report additionally provides quantitative information regarding Semiconductor Backend Equipment industry financial numbers, selected key players and company details, as well as employee and salary data.

In the coming years, Semiconductor Backend Equipment market will continue to focus their efforts on product innovation in order to attract new consumers and keep existing consumers loyal to specific brands.

Below is the majority of the content covered in this report

  • Semiconductor Backend Equipment Product details, including pictures and technical specifications
  • Semiconductor Backend Equipment manufacturers, distributors and channels
  • Major players present in the Semiconductor Backend Equipment
  • Information on competitor market shares, revenue, unit sales etc
  • Breakdown by applications for the Market
  • Value chain and distributor details in the market

This report covers a strategic profiling of the following key players in the Semiconductor Backend Equipment market

  • Tokyo Electron Limited
  • LAM Research Corporation
  • ASML Holdings N.V.
  • Applied Materials Inc.
  • KLA-Tencor Corporation.
  • Screen Holdings Co., Ltd.
  • Teradyne Inc.
  • Advantest Corporation
  • Hitachi High-Technologies Corporation.
  • Plasma-Therm.
  • Rudolph Technologies, Inc
  • Startup Ecosystem
  • On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
  • Assembly & Packaging Equipment
  • Dicing Equipment
  • Bonding Equipment
  • Metrology Equipment
  • Test Equipment
  • On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including
  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace & Defense

The report covers the information pertaining to following geographies

  • North America
  • Europe
  • China
  • Japan
  • Southeast Asia
  • India
  • Tokyo Electron Limited
  • LAM Research Corporation
  • ASML Holdings N.V.
  • Applied Materials Inc.
  • KLA-Tencor Corporation.
  • Screen Holdings Co., Ltd.
  • Teradyne Inc.
  • Advantest Corporation
  • Hitachi High-Technologies Corporation.
  • Plasma-Therm.
  • Rudolph Technologies, Inc
  • Startup Ecosystem
  • Assembly & Packaging Equipment
  • Dicing Equipment
  • Bonding Equipment
  • Metrology Equipment
  • Test Equipment
  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace & Defense

Additionally, the market is segmented by the following sectors

  • Assembly & Packaging Equipment
  • Dicing Equipment
  • Bonding Equipment
  • Metrology Equipment
  • Test Equipment
  • On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including
  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace & Defense
  • If you have any special requirements, please let us know and we will offer you the report as you want.

Please contact us if you are looking for any other possible breakdown across the products.

Not only this, figures covering the end user applications are also provided according to the following classification

  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace & Defense

In summary, the report serves to study and analyse the Semiconductor Backend Equipment size (value & volume) by company, key regions/countries, products and application, history data from 2013 to 2017, and forecast to 2025. This report includes the estimation of market size for value (million US$) and volume (K MT). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Semiconductor Backend Equipment, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

Overall the report is an excellent source for managers, researches and top executives alike to analyse and get clarity on the market standings and business forecast. We provide the information after thorough research and analysis saving precious hours and budget for the companies. We have been serving major clients like Sony, BCG, PWC, Mck, Hewlett Packard, Technicolor Etc.

  • Global Semiconductor Backend Equipment Market Research Report 2018
  • 1 Semiconductor Backend Equipment Market Overview
    • 1.1 Product Overview and Scope of Semiconductor Backend Equipment
    • 1.2 Semiconductor Backend Equipment Segment by Type (Product Category)
      • 1.2.1 Global Semiconductor Backend Equipment Production and CAGR (%) Comparison by Type (Product Category)(2013-2025)
      • 1.2.2 Global Semiconductor Backend Equipment Production Market Share by Type (Product Category) in 2017
      • 1.2.3 Assembly & Packaging Equipment
      • 1.2.4 Dicing Equipment
      • 1.2.5 Bonding Equipment
      • 1.2.6 Metrology Equipment
      • 1.2.7 Test Equipment
    • 1.3 Global Semiconductor Backend Equipment Segment by Application
      • 1.3.1 Semiconductor Backend Equipment Consumption (Sales) Comparison by Application (2013-2025)
      • 1.3.2 Consumer Electronics
      • 1.3.3 Automotive
      • 1.3.4 Healthcare
      • 1.3.5 Aerospace & Defense
    • 1.4 Global Semiconductor Backend Equipment Market by Region (2013-2025)
      • 1.4.1 Global Semiconductor Backend Equipment Market Size (Value) and CAGR (%) Comparison by Region (2013-2025)
      • 1.4.2 North America Status and Prospect (2013-2025)
      • 1.4.3 Europe Status and Prospect (2013-2025)
      • 1.4.4 China Status and Prospect (2013-2025)
      • 1.4.5 Japan Status and Prospect (2013-2025)
      • 1.4.6 Southeast Asia Status and Prospect (2013-2025)
      • 1.4.7 India Status and Prospect (2013-2025)
    • 1.5 Global Market Size (Value) of Semiconductor Backend Equipment (2013-2025)
      • 1.5.1 Global Semiconductor Backend Equipment Revenue Status and Outlook (2013-2025)
      • 1.5.2 Global Semiconductor Backend Equipment Capacity, Production Status and Outlook (2013-2025)
  • 2 Global Semiconductor Backend Equipment Market Competition by Manufacturers
    • 2.1 Global Semiconductor Backend Equipment Capacity, Production and Share by Manufacturers (2013-2018)
      • 2.1.1 Global Semiconductor Backend Equipment Capacity and Share by Manufacturers (2013-2018)
      • 2.1.2 Global Semiconductor Backend Equipment Production and Share by Manufacturers (2013-2018)
    • 2.2 Global Semiconductor Backend Equipment Revenue and Share by Manufacturers (2013-2018)
    • 2.3 Global Semiconductor Backend Equipment Average Price by Manufacturers (2013-2018)
    • 2.4 Manufacturers Semiconductor Backend Equipment Manufacturing Base Distribution, Sales Area and Product Type
    • 2.5 Semiconductor Backend Equipment Market Competitive Situation and Trends
      • 2.5.1 Semiconductor Backend Equipment Market Concentration Rate
      • 2.5.2 Semiconductor Backend Equipment Market Share of Top 3 and Top 5 Manufacturers
      • 2.5.3 Mergers & Acquisitions, Expansion
  • 3 Global Semiconductor Backend Equipment Capacity, Production, Revenue (Value) by Region (2013-2018)
    • 3.1 Global Semiconductor Backend Equipment Capacity and Market Share by Region (2013-2018)
    • 3.2 Global Semiconductor Backend Equipment Production and Market Share by Region (2013-2018)
    • 3.3 Global Semiconductor Backend Equipment Revenue (Value) and Market Share by Region (2013-2018)
    • 3.4 Global Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
    • 3.5 North America Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
    • 3.6 Europe Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
    • 3.7 China Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
    • 3.8 Japan Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
    • 3.9 Southeast Asia Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
    • 3.10 India Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
  • 4 Global Semiconductor Backend Equipment Supply (Production), Consumption, Export, Import by Region (2013-2018)
    • 4.1 Global Semiconductor Backend Equipment Consumption by Region (2013-2018)
    • 4.2 North America Semiconductor Backend Equipment Production, Consumption, Export, Import (2013-2018)
    • 4.3 Europe Semiconductor Backend Equipment Production, Consumption, Export, Import (2013-2018)
    • 4.4 China Semiconductor Backend Equipment Production, Consumption, Export, Import (2013-2018)
    • 4.5 Japan Semiconductor Backend Equipment Production, Consumption, Export, Import (2013-2018)
    • 4.6 Southeast Asia Semiconductor Backend Equipment Production, Consumption, Export, Import (2013-2018)
    • 4.7 India Semiconductor Backend Equipment Production, Consumption, Export, Import (2013-2018)
  • 5 Global Semiconductor Backend Equipment Production, Revenue (Value), Price Trend by Type
    • 5.1 Global Semiconductor Backend Equipment Production and Market Share by Type (2013-2018)
    • 5.2 Global Semiconductor Backend Equipment Revenue and Market Share by Type (2013-2018)
    • 5.3 Global Semiconductor Backend Equipment Price by Type (2013-2018)
    • 5.4 Global Semiconductor Backend Equipment Production Growth by Type (2013-2018)
  • 6 Global Semiconductor Backend Equipment Market Analysis by Application
    • 6.1 Global Semiconductor Backend Equipment Consumption and Market Share by Application (2013-2018)
    • 6.2 Global Semiconductor Backend Equipment Consumption Growth Rate by Application (2013-2018)
    • 6.3 Market Drivers and Opportunities
      • 6.3.1 Potential Applications
      • 6.3.2 Emerging Markets/Countries
  • 7 Global Semiconductor Backend Equipment Manufacturers Profiles/Analysis
    • 7.1 Tokyo Electron Limited
      • 7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.1.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.1.2.1 Product A
        • 7.1.2.2 Product B
      • 7.1.3 Tokyo Electron Limited Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.1.4 Main Business/Business Overview
    • 7.2 LAM Research Corporation
      • 7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.2.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.2.2.1 Product A
        • 7.2.2.2 Product B
      • 7.2.3 LAM Research Corporation Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.2.4 Main Business/Business Overview
    • 7.3 ASML Holdings N.V.
      • 7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.3.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.3.2.1 Product A
        • 7.3.2.2 Product B
      • 7.3.3 ASML Holdings N.V. Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.3.4 Main Business/Business Overview
    • 7.4 Applied Materials Inc.
      • 7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.4.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.4.2.1 Product A
        • 7.4.2.2 Product B
      • 7.4.3 Applied Materials Inc. Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.4.4 Main Business/Business Overview
    • 7.5 KLA-Tencor Corporation.
      • 7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.5.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.5.2.1 Product A
        • 7.5.2.2 Product B
      • 7.5.3 KLA-Tencor Corporation. Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.5.4 Main Business/Business Overview
    • 7.6 Screen Holdings Co., Ltd.
      • 7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.6.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.6.2.1 Product A
        • 7.6.2.2 Product B
      • 7.6.3 Screen Holdings Co., Ltd. Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.6.4 Main Business/Business Overview
    • 7.7 Teradyne Inc.
      • 7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.7.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.7.2.1 Product A
        • 7.7.2.2 Product B
      • 7.7.3 Teradyne Inc. Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.7.4 Main Business/Business Overview
    • 7.8 Advantest Corporation
      • 7.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.8.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.8.2.1 Product A
        • 7.8.2.2 Product B
      • 7.8.3 Advantest Corporation Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.8.4 Main Business/Business Overview
    • 7.9 Hitachi High-Technologies Corporation.
      • 7.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.9.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.9.2.1 Product A
        • 7.9.2.2 Product B
      • 7.9.3 Hitachi High-Technologies Corporation. Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.9.4 Main Business/Business Overview
    • 7.10 Plasma-Therm.
      • 7.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
      • 7.10.2 Semiconductor Backend Equipment Product Category, Application and Specification
        • 7.10.2.1 Product A
        • 7.10.2.2 Product B
      • 7.10.3 Plasma-Therm. Semiconductor Backend Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 7.10.4 Main Business/Business Overview
    • 7.11 Rudolph Technologies, Inc
    • 7.12 Startup Ecosystem
  • 8 Semiconductor Backend Equipment Manufacturing Cost Analysis
    • 8.1 Semiconductor Backend Equipment Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
    • 8.1.2 Price Trend of Key Raw Materials
    • 8.1.3 Key Suppliers of Raw Materials
    • 8.1.4 Market Concentration Rate of Raw Materials
    • 8.2 Proportion of Manufacturing Cost Structure
    • 8.2.1 Raw Materials
    • 8.2.2 Labor Cost
    • 8.2.3 Manufacturing Expenses
    • 8.3 Manufacturing Process Analysis of Semiconductor Backend Equipment
  • 9 Industrial Chain, Sourcing Strategy and Downstream Buyers
    • 9.1 Semiconductor Backend Equipment Industrial Chain Analysis
    • 9.2 Upstream Raw Materials Sourcing
    • 9.3 Raw Materials Sources of Semiconductor Backend Equipment Major Manufacturers in 2017
    • 9.4 Downstream Buyers
  • 10 Marketing Strategy Analysis, Distributors/Traders
    • 10.1 Marketing Channel
      • 10.1.1 Direct Marketing
      • 10.1.2 Indirect Marketing
      • 10.1.3 Marketing Channel Development Trend
    • 10.2 Market Positioning
      • 10.2.1 Pricing Strategy
      • 10.2.2 Brand Strategy
      • 10.2.3 Target Client
    • 10.3 Distributors/Traders List
  • 11 Market Effect Factors Analysis
    • 11.1 Technology Progress/Risk
      • 11.1.1 Substitutes Threat
      • 11.1.2 Technology Progress in Related Industry
    • 11.2 Consumer Needs/Customer Preference Change
    • 11.3 Economic/Political Environmental Change
  • 12 Global Semiconductor Backend Equipment Market Forecast (2018-2025)
    • 12.1 Global Semiconductor Backend Equipment Capacity, Production, Revenue Forecast (2018-2025)
      • 12.1.1 Global Semiconductor Backend Equipment Capacity, Production and Growth Rate Forecast (2018-2025)
      • 12.1.2 Global Semiconductor Backend Equipment Revenue and Growth Rate Forecast (2018-2025)
      • 12.1.3 Global Semiconductor Backend Equipment Price and Trend Forecast (2018-2025)
    • 12.2 Global Semiconductor Backend Equipment Production, Consumption , Import and Export Forecast by Region (2018-2025)
      • 12.2.1 North America Semiconductor Backend Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
      • 12.2.2 Europe Semiconductor Backend Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
      • 12.2.3 China Semiconductor Backend Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
      • 12.2.4 Japan Semiconductor Backend Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
      • 12.2.5 Southeast Asia Semiconductor Backend Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
      • 12.2.6 India Semiconductor Backend Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
    • 12.3 Global Semiconductor Backend Equipment Production, Revenue and Price Forecast by Type (2018-2025)
    • 12.4 Global Semiconductor Backend Equipment Consumption Forecast by Application (2018-2025)
  • 13 Research Findings and Conclusion
  • 14 Appendix
    • 14.1 Methodology/Research Approach
      • 14.1.1 Research Programs/Design
      • 14.1.2 Market Size Estimation
      • 14.1.3 Market Breakdown and Data Triangulation
    • 14.2 Data Source
      • 14.2.1 Secondary Sources
      • 14.2.2 Primary Sources
    • 14.3 Disclaimer

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PRIMARY RESEARCH
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.

SECONDARY RESEARCH
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.

MARKET ENGINEERING
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.

EXPERT VALIDATION
The market engineered data is verified and validated by a number of experts, both in-house and external.

REPORT WRITING/ PRESENTATION
After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.

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